Smart Engineering Systems: Design and Ap Nanoelectronics: Materials to Chips Design, (Paperback)

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<p>This book exhibits a unique way of explaining nanomaterials and devices and analyzing their design parameters to meet the sub-nanoregime challenges for low-power chip design. Since process variability, device sizing, and power supply scaling are ongoing challenges in very large-scale integration (VLSI) circuit designs, this book highlights the conventional and novel nanomaterials, devices and circuits, leakage current mitigation techniques, and other important trade-offs along with exhaustive analysis. More focus has been placed throughout the book on various trade-offs for high-speed and low-power VLSI devices and circuits co-design. </p><p>This book: </p><ul> <li>Discusses advanced nano-semiconductor devices such as FinFET, nanowires, tunnel field-effect transistors, carbon nanotube field-effect transistors, and high-electron-mobility transistors</li> <li>Presents high-performance semiconductor devices at nanoscale technology nodes for the analysis of quantum effects and their impact on circuits and systems</li> <li>Covers power dissipation and reduction techniques for high-performance devices</li> <li>Explains both silicon and non-silicon devices for various applications like digital logic and analog/radio frequency applications</li> <li>Examines the difficulties and practical design approaches for extremely low-power analog-integrated circuits</li> </ul><p>It is primarily written for senior undergraduates, graduate students, and academic researchers in the fields of electrical engineering, electronics and communications engineering, materials science, nanoscience, and nanotechnology.</p>

  • Smart Engineering Systems: Design and Ap Nanoelectronics: Materials to Chips Design, (Paperback)
  • Author: Balwinder Raj
  • ISBN: 9781032984629
  • Format: Paperback
  • Publication Date: 2026-08-27
  • Page Count: 358
Book format Paperback
Fiction/nonfiction Non-Fiction
Genre Computing & Internet
Pages 358
Subgenre Electronics
Series title Smart Engineering Systems: Design and Applications
Number in series 0
Edition 1
Publisher CRC Press
Language English
Is collectible N
Recording time 0 min
Retail packaging Single Piece
Assembled product dimensions (l x w x h) 6.13 x 6.00 x 9.19 in
Assembled product weight 1.25 lb
Bisac subject heading Technology & Engineering

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